Privacy Policy
Last updated: 2026-09-15
Who we are
This website and our business outreach are operated by MATERIAL LAB USA LLC, 8 The Green, Suite D, Dover, DE 19901, USA ("Material Lab", "we", "us"). We design and build brands, websites and apps for businesses.
Questions about this policy or your information: damini@materiallab.io.
Visitors to this website
We do not use analytics, advertising or tracking cookies on this website, and we do not ask you to create an account.
Like any website, loading it involves some third-party services that receive technical information such as your IP address and browser details in order to deliver content:
- GitHub Pages, which hosts the site.
- Google Fonts, cdnjs (Cloudflare) and jsDelivr, which serve fonts and code libraries.
- Unsplash and Simple Icons, which serve images and icons.
If you click a link to WhatsApp, LinkedIn, X or our blog, that service's own privacy policy applies from then on.
Business outreach by email
We contact businesses by email about our website, design and app services.
- What we collect: business contact details, such as name, work email address, job title and company, taken from public company sources.
- Why: to contact businesses about services that may be relevant to them.
- Who processes it for us: Instantly (email sending) and Google Workspace (our mailbox).
Opting out
You can stop our emails at any time by using the unsubscribe link in any email, replying "unsubscribe", or writing to damini@materiallab.io. We honor opt-outs promptly.
How long we keep it
- Contact and outreach records are deleted 12 months after our last contact with you, unless you engaged with us.
- If you opt out, we keep a suppression record indefinitely so that we never contact you again.
Your rights
You can ask us what information we hold about you, and ask us to correct or delete it, by emailing damini@materiallab.io. Depending on where you live, you may have further rights under local law.
Changes
If we change this policy, we will update the date at the top of this page.